Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds ...
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Organic Solderability Preservative (OSP, deutsch organischer Oberflächenschutz) ist ein Verfahren der Aufbau- und Verbindungstechnik, um die metallisch ...
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds ...
OSP (Organic solderability preservative): usually imidazole-class compounds forming a thin layer on the copper surface. Copper readily dissolves in high-tin ...
ENIG and ENEPIG are meant to replace the more conventional coatings of solder, such as hot air solder leveling (HASL/HAL). ... Organic solderability preservative ...
Organic solderability preservative compositions - Free Patents Online
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Jan 12, 1999 · Known organic solderability preservatives (OSP) contain an azole compound and are applied on a copper surface from an acidic solution.
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This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High. Temperature) for Pb-free soldering. It is ...
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Jul 30, 2016 · Organic Solderability Preservative, or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that ...
... organic solderability preservative finish were assembled by a reflow soldering process. ... organic solderability preservative ... Earlier, a definition of t eff, ...
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Other platings used are organic solderability preservative (OSP), immersion ... Areas that should not be soldered may be covered with solder resist (solder mask).